We will attend the EXPO PACK INTERNATIONAL 2018 in Chicago, USA in October 14—17 2018.
At W-503, we will demonstrate our Blister Packaging Line and Capsule Filling Machine and takes this opportunity to meet with you to discuss solutions for processing and packaging.
Through integration of a blister and cartoner module for packaging and cartoning of pharmaceutical products, this Blister Line is Jornen's innovative response to the need for high efficiency and low-cost operation, flexible for medium and small batch production.
It is the culmination of our 30 years of professional expererience in the blister packaging field.
It is a fundamental privilege to listen, converse and reflect on problems and solutions, and to create innovation.
We look forward to meeting you at our booth!